Congratulations on the successful opening ceremony of Jiangsu Senbo New Material Co., LTD
Posted on 2020-12-05
On December 5th, the opening ceremony of Jiangsu Senbo New Material Co., LTD., the governing unit of Suzhou Wenzhou Chamber of Commerce, was held in Nantong new factory. Customers and guests from all walks of life witnessed the new development stage of Jiangsu Senbo New Material Co., LTD.
Mr. Huang Zhidong, the General Secretary of Wenzhou Chamber of Commerce, and other representatives of the chamber of commerce arrived to congratulate the Openning Ceremony.
Company founded in 2016, is located in the first phase of Yangkou Port Industrial Park, Changsha Town, Rudong County, Jiangsu Province, where in the economically developed hinterland of the Yangtze River Delta, the geographical location is superior, convenient transportation network.
The company is built-up with high-tech facilities of productionvand equiped with research and development center.
Jiangsu Senbo New Material Co., Ltd. is the deputy director of CPRA, mainly focus on production and sales of phenolic resins and molding plastics.
Mr. Huang Zhi, General Manager, engaged in phenolic resin and phenolic molding industry for 15 years. He is the director of Wenzhou Chamber of Commerce in Suzhou.
Jiangsu Senbo New Materials Co., LTD., with an initial investment of 350 million RMB and occupation of 8,2000 M3 land, mainly produces 50,000 tons of high-performance phenolic molding plastics and 45,000 tons of high-performance phenolic resin products.
The second phase of the project which occupaid 7,1000M of land is planned to be developed and constructed 3 years after the first phase is put into production.It will rovide additional capacity of 50,000 tons of phenolic molding plastics and 55,000 tons of phenolic resins. In the time, the total capacity of 100,000 tons of phenolic molding plastics and 100,000 tons of phenolic resins will be provided.
The new capaciy will enhance the production capacity and move into the high-end market, involving automotive equipment, chip packaging and other industries.